Click here for EDACafe
Search:
Click here for IBSystems
  Home | EDA Weekly | Companies | Downloads | e-Catalog | IP | Interviews | Forums | News | Resources |
  Check Email | Submit Material | Universities | Books | Events | Advertise | PCBCafe| Subscription | techjobscafe |  ItZnewz  |
 Lunch & Learn Seminar
http://www.mentor.com/dft
Atrenta
 EDACafe  EDA Portal, EDA News, EDA Jobs, EDA Presentations, EDA Newsgroups, Electronic Design Automation.

New Voice Echo Canceller Chips from Zarlink Improve Voice Quality in Noisy Environments

- 256-channel and 32-channel chips deliver enhanced noise-matching features for wired and wireless equipment

OTTAWA, Sept. 14 /PRNewswire-FirstCall/ -- Zarlink Semiconductor (NYSE/TSX:ZL) today introduced two new VEC (voice echo canceller) devices with advanced features that help ensure carrier-grade voice quality for packet- based and cellular networking equipment operating in high-noise environments.

Zarlink's 256-channel ZL(TM) 38070 and 32-channel ZL38065 VECs are high- capacity, low-power devices that use patented NLP (non-linear processing) software to deliver improved noise-matching techniques. In addition, the devices' programmable threshold and convergence speeds improve double-talk performance. The VECs are ideal for IP-PBXs (Internet Protocol-Private Branch Exchanges), 3G wireless base stations, mobile switching centers and other equipment operating in noisy settings.

The demand for higher-quality VECs is growing as service providers roll out voice-over-packet and cellular networks, where it is more challenging to achieve carrier-class voice service. Today's VECs must handle voice echo issues that are often emphasized by the longer signal processing and transmission delays associated with packet and wireless networks. These problems are compounded by excessive background noise that further effects call quality.

"Building on the field-proven success of our voice echo canceller family, our new devices remove echo and ensure that callers are not plagued by annoying changes in background noise, regardless of operating conditions," said Andre Coucopoulos, product marketing manager, Voice Echo Cancellers, Zarlink Semiconductor. "These VEC chips also deliver significant power savings for equipment manufacturers."

Enhanced software for difficult operating conditions

The ZL38065 and ZL38070 VECs improve voice quality in equipment where the convergence of voice and data traffic on a packet network causes processing delays that emphasize echo. In addition, excessive background noise will affect call quality when equipment is operating in a high-noise environment, such as an industrial setting or airport terminal.

Zarlink's new VEC chips use patented NLP software that includes several features to improve voice quality. The software's algorithm injects onto the line spectrally matched "comfort noise" that is adjusted to match caller background noise and eliminate noise gating when echoes are cancelled.

With superior noise matching capabilities, Zarlink's new VECs can handle intense background noise, ensuring seamless voice quality in high-noise situations. In comparison, less effective noise matching often results in annoying background noise on the line that sounds "choppy" to users. Double- talk, when two callers are speaking at the same time, poses a unique challenge for VECs as they must distinguish the conversation from background noise. Zarlink's VECs feature fully programmable per-channel convergence speeds, allowing designers to tailor the performance of the devices to achieve the best double-talk call quality for their application.

The ZL38070 high-density VEC can be configured to offer 256 channels of echo cancellation at 64 ms (milliseconds), 128 channels at 128 ms, or other combinations of channel density and echo delay. The low-density ZL38065 device can be configured to offer 32 channels of echo cancellation at 64 ms, 16 channels at 128 ms, or other combinations of channel density and echo delay.

Unmatched power efficiency

Consuming only 4.68 mW (milliwatts) of power per channel, Zarlink's new VEC chips meet customer requirements for power-efficient echo cancellers. In addition, individual blocks can be turned off when not all channels are in use, drastically reducing power requirements. For example, in a mobile switching center where overall power consumption is a critical design concern, the high-density ZL38070 VEC delivers power efficiency and flexibility advantages.

The ZL38065 and ZL38070 VECs are fully compliant with the ITU-T's (International Telecommunication Union-Telecommunications) G.168 (2000) standard for digital echo cancellers and G.164/165 standards for fax/modem transmissions.

Availability, packaging and price

Zarlink's newest VEC chips are now in production. The 32-channel ZL38065 device is packaged in a 100-pin LQFP (low-profile quad flat pack) or 208-ball LBGA (low-pitch ball grid array) and is priced at US$52 in volumes of 1,000. The 256-channel ZL38070 chip is packaged in a 535-ball PBGA (plastic ball grid array) and is priced at US$244 in volumes of 1,000. Both devices are fully supported by an evaluation board and reference design.

  For more information, visit
  http://products.zarlink.com/product_profiles/ZL38065 and
  http://products.zarlink.com/product_profiles/ZL38070 .

  About Zarlink Semiconductor

For almost 30 years, Zarlink Semiconductor has delivered semiconductor solutions that drive the capabilities of voice, enterprise, broadband and wireless communications. The Company's success is built on its technology strengths, including voice and data networks, consumer and ultra low-power communications, and high-performance analog. For more information, visit http://www.zarlink.com/ .

  Certain statements in this press release constitute forward-looking
  statements within the meaning of the Private Securities Litigation Reform
  Act of 1995. Such forward-looking statements involve known and unknown
  risks, uncertainties, and other factors which may cause the actual
  results, performance or achievements of the Company to be materially
  different from any future results, performance, or achievements expressed
  or implied by such forward-looking statements. Such risks, uncertainties
  and assumptions include, among others, the risks discussed in documents
  filed by the Company with the Securities and Exchange Commission.
  Investors are encouraged to consider the risks detailed in those filings.

  Zarlink, ZL, and the Zarlink Semiconductor logo are trademarks of Zarlink
  Semiconductor Inc. A high-resolution photograph is available at
  http://news.zarlink.com/visual_center/ .

CONTACT: Zarlink - Michael Salter, Media Relations, (613) 270-7115,
michael.salter@zarlink.com; United States - Natalie Sauve, High Road
Communications, (613) 236-0909, nsauve@highroad.com; Europe - Simon Krelle,
Pinnacle Marketing Communications, 44 (0) 7973 821036,
simonk@pinnacle-marketing.com

http://www.mentor.com/pcb
http://www.mentor.com/dft
Cadence
http://www.mentor.com/dsm
Slivaco


Click here for Internet Business Systems Copyright 1994 - 2004, Internet Business Systems, Inc.
1-888-44-WEB-44 --- Contact us, or visit our other sites:
AECCafe  DCCCafe  TechJobsCafe  GISCafe  MCADCafe  NanoTechCafe  PCBCafe  
  Privacy Policy